DuPont Interconnect Solutions to Showcase HP Pyralux Laminate Adhesive System at IPC APEX EXPO 2022

DuPont Interconnect Solutions to Showcase HP Pyralux Laminate Adhesive System at IPC APEX EXPO 2022

DuPont Interconnect Solutions (ICS), an Electronics and Industrial segment company, will showcase the Pyralux HP laminated adhesive system at the Institute for Printed Circuits (IPC) APEX 2022 in San Diego, CA , from January 25 to 27. 2022.

In today’s high-performance electronic devices, data consumption continues to push the boundaries in a variety of end-market segments. High-speed signal transfer over the network creates many environments where signal integrity is often reduced, resulting in costly issues for end users. These issues are of utmost importance in demanding applications where reliability and high performance are critical to success.

To improve the performance of these devices, DuPont has developed the epoxy-based Pyralux® HP laminated adhesive system that combines best-in-class insertion loss performance with increased functionality and processing. This engineered solution has been specifically designed for Original Equipment Manufacturers (OEMs) and Printed Circuit Board (PCB) manufacturers to meet the needs of high performance, high reliability applications in the telecommunications, networking , medicine, industry, military and aerospace.

The Pyralux® HP laminated adhesive system has robust processability while maintaining excellent electrical performance to optimize signal integrity in demanding and extreme PCB applications. This IPC-certified product is available as a sheet adhesive or coating that is well suited for a wide variety of multi-ply and rigid-flex flexible applications. The Pyralux® HP laminate adhesive system allows for processing at lower temperatures, giving PCB designers and producers a wide range of applications they can support when using this unique system.

“We are delighted to offer our customers this best-in-class laminate adhesive system as a core offering in our Pyralux® product portfolio,” said Andy Kannurpatti, Global Business Manager, DuPont ICS Films & Laminates. “The Pyralux® HP adhesive laminate system is another example of why DuPont has been the preferred supplier of flexible laminate solutions for over 40 years. Our innovation in offering the widest range of PCB build options boosts device speed and reliability – enabling a range of applications from 5G connectivity to autonomous vehicles,” said Kannurpatti.